World Wide Technology firms $669 million term loan at par issue price

By Sara Rosenberg

New York, March 8 – World Wide Technology Holding Co. LLC set the issue price on its $669 million term loan B due 2030 at par, the tight end of the 99.75 to par talk, according to a market source.

Pricing on the term loan remained at SOFR+10 basis points CSA plus 275 bps with a 0.5% floor.

JPMorgan Chase Bank is the lead on the deal.

Proceeds will be used to reprice an existing term loan B due 2030 down from SOFR+CSA plus 325 bps with a 0.5% floor. The existing loan is being paid down by about $75 million in connection with the transaction.

World Wide Technology is a St. Louis-based provider of information technology supply chain solutions.

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