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Prospect News home > News index > List of issuers S > Headlines for Summer Spring Project Ltd. > News item
Published on 4/19/2023 in the Prospect News Emerging Markets Daily.

New Issue: China’s Summer Spring issues €60 million 5½% bonds due 2024

Chicago, April 18 – Summer Spring Project Ltd. issued €60 million 5½% bonds due 2024, according to a notice.

The issuer is the primary development, construction and operation platform for the Changde municipal government in China.

Issuer:Summer Spring Project Ltd.
Amount:€60 million
Issue:Bonds
Maturity:April 17, 2024
Coupon:5½%
Settlement date:April 19
Listing date:April 20
ISIN:XS2598130180

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