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Published on 11/9/2021 in the Prospect News Emerging Markets Daily.

New Issue: China’s Shanghai Land issues RMB 750 million 3.7% bonds due 2024

By William Gullotti

Buffalo, N.Y., Nov. 9 – China’s Shanghai Land (Group) Co., Ltd. priced RMB 750 million of 3.7% bonds due 2024, according to a listing notice on Tuesday.

The lead manager and bookrunner for the offering is Shanghai Pudong Development Bank Co., Ltd., Hong Kong Branch.

Listing for the bonds is expected on the Singapore Exchange effective Nov. 10.

The issuer operates real estate development businesses.

Issuer:Shanghai Land (Group) Co., Ltd.
Issue:Bonds
Amount:RMB 750 million
Maturity:Oct. 20, 2024
Bookrunner:Shanghai Pudong Development Bank Co., Ltd., Hong Kong Branch
Coupon:3.7%
Issue date:Oct. 20
Listing date:Nov. 10
ISIN:SGXT85497301

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