By William Gullotti
Buffalo, N.Y., Aug. 5 – Xi’an Aerospace High-tech Industry Development Group Co., Ltd. is listing $48 million of 2% credit enhanced bonds due 2024, according to a notice Thursday.
The bonds feature the benefit of an irrevocable standby letter of credit from Shanghai Pudong Development Bank Co., Ltd. Hong Kong Branch.
Fosun Hani, Shanghai Pudong Development Bank Hong Kong Branch, China Minsheng Banking Corp., Ltd., Hong Kong Branch, Wilson Securities, CEB International and Bocom International are the placing agents for the offering.
The Regulation S bonds are expected to be listed on the Stock Exchange of Hong Kong Ltd. on Aug. 6.
The company is a state-owned entity focused on property and infrastructure development in the Xi’an National Civil Aerospace Industrial Base.
| Issuer: | Xi’an Aerospace High-tech Industry Development Group Co., Ltd.
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| Issue: | Credit enhanced bonds
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| Amount: | $48 million
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| Maturity: | 2024
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| Placing agents: | Fosun Hani, Shanghai Pudong Development Bank Hong Kong Branch, China Minsheng Banking Corp., Ltd., Hong Kong Branch, Wilson Securities, CEB International and Bocom International
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| Coupon: | 2%
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| Pricing date: | July 30
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| Listing date: | Aug 6
|
| Distribution: | Regulation S
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