Tsinghua reorganization plan ruled complete by court

By Wendy Van Sickle

Columbus, Ohio, July 13 – Tsinghua Unigroup Co., Ltd. said the reorganization plan that consolidated and reorganized the company with six subsidiaries was ruled complete by a court, according to a company announcement.

The company is the guarantor of the $750 million 5 3/8% bonds due 2023 and $200 million 6½% bonds due 2028 issued by Tsinghua Unic Ltd. Trading of those bonds was suspended on Nov. 18, 2020 and continues to be suspended.

The chip maker supplies digital infrastructure and services and is based in Beijing.

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