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Taiwan’s Advanced Semiconductor to sell up to NT$8 billion bonds
By Marisa Wong
Morgantown, W.Va., Dec. 8 – Advanced Semiconductor Engineering, Inc. announced it plans to issue up to NT$8 billion of corporate bonds.
The bonds will have maturities of five and seven years and will be priced at par with a fixed coupon of 2% or less.
Proceeds will be used to repay bank loans.
This will be the company’s first issue of corporate bonds for 2016.
The semiconductor assembly and test services supplier is based in Kaohsiung, Taiwan.
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