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Taiwan’s GlobalWafers plans up to NT$22 billion corporate bonds
By Marisa Wong
Los Angeles, April 21 – GlobalWafers Co., Ltd. plans to issue up to NT$22 billion of fixed- or floating-rate corporate bonds, according to a notice.
The company is seeking to raise medium- to long-term funds to pay off loans, replenish working capital, reinvest in domestic or overseas companies or purchase machines and equipment.
The semiconductor company is based in Hsinchu, Taiwan.
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