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Published on 3/5/2021 in the Prospect News Emerging Markets Daily.

New Issue: Beijing Capital’s Central Plaza sells $100 million add-on to 4.65% bonds due 2026

By Wendy Van Sickle

Columbus, Ohio, March 5 – China’s Central Plaza Development Ltd. priced a $100 million add-on to its 4.65% bonds due Jan. 19, 2026 at 100.412, according to a market release.

The bonds are guaranteed by BCG Chinastar International Investment Ltd.

The notes will be consolidated and form a single series with the $400 million of notes issued by the company on Jan. 19.

In addition to the guarantee, parent Beijing Capital Group Co., Ltd. has also supplied a keepwell and liquidity support deed and the deed of equity interest purchase undertaking for the issue.

Joint global coordinators, joint bookrunners and joint lead managers are Hongkong and Shanghai Banking Corp. Ltd., Guotai Junan Securities (Hong Kong) Ltd, and China International Capital Corp. Hong Kong Securities Ltd.

Joining the global coordinators as joint bookrunners and joint lead managers are China Citic Bank International Ltd., China Securities (International) Corporate Finance Co. Ltd., CNCB (Hong Kong) Capital Ltd. and China Everbright Bank Co., Ltd., Hong Kong Branch.

Proceeds will be used to refinance mid-term and long-term offshore debt due within one year.

Approval in principle for the listing of the bonds on the Singapore Exchange has been granted.

The integrated property owner is based in Beijing.

Issuer:Central Plaza Development Ltd.
Guarantor:BCG Chinastar International Investment Ltd.
Issue:Bonds
Amount:$100 million add-on
Maturity:Jan. 19, 2026
Bookrunners:Hongkong and Shanghai Banking Corp. Ltd., Guotai Junan Securities (Hong Kong) Ltd., China International Capital Corp. Hong Kong Securities Ltd., China Citic Bank International Ltd., China Securities (International) Corporate Finance Co. Ltd., CNCB (Hong Kong) Capital Ltd. and China Everbright Bank Co., Ltd., Hong Kong Branch
Coupon:4.65%
Price:100.412
Pricing date:March 4
Settlement date:March 10
Original issue:$400 million issued on Jan. 19

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