Viasystems expected to sell $200 million bonds to fund tender offer

By Paul A. Harris

St. Louis, Oct. 28 - Viasystems, Inc. is expected to bring to market a $200 million offering of bonds in order to fund the tender for its 10½% senior subordinated notes due 2011, according to a market source.

Goldman Sachs & Co. is the deal manager for the tender offer. The early consent date is Nov. 9.

Viasystems is a St. Louis-based provider of complex multi-layer PCBs and electro-mechanical solutions.

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