Published on 2/21/2006 in the Prospect News Emerging Markets Daily.
New Issue: Peru's Telefonica Moviles sells S/. 35 million, $30 million series A bonds at par
By Caroline Salls
Pittsburgh, Feb. 21 - Telefonica Moviles SA made the third and fourth issues under its first program of series A bonds, selling S/. 35 million of the bonds at par to yield 7.4375% under the third issue and $30 million of the bonds at par to yield 5.25% under the fourth issue, according to a company news release.
The issuer is a Lima, Peru, mobile telephone company.
| Issuer: | Telefonica Moviles SA
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| Issue: | Series A
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| Pricing date: | Feb. 21
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| Settlement date: | Feb. 22
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| Third issue
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| Amount: | S/. 35 million
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| Maturity: | Feb. 22, 2013
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| Price: | Par
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| Yield: | 7.4375%
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| Fourth issue
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| Amount: | $30 million
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| Maturity: | May 22, 2007
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| Price: | Par
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| Yield: | 5.25%
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