Published on 2/13/2006 in the Prospect News Emerging Markets Daily.
New Issue: Peru's Telefonica Moviles prices S/. 50 million, $30 million series A bonds at par
By Caroline Salls
Pittsburgh, Feb. 13 - Telefonica Moviles SA made the second and fifth issues under its first program of series A bonds, selling S/. 50 million under the second issue and $30 million under the fifth issue, according to a company news release.
The second issue bonds were priced at par to yield 7.0625% and the fifth issue also priced at par to yield 5.3125%.
The issuer is a Lima, Peru, mobile telephone company.
| Issuer: | Telefonica Moviles SA
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| Issue: | Series A bonds
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| Price: | Par
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| Pricing date: | Feb. 13
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| Settlement date: | Feb. 14
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| Second issue:
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| Amount: | S/. 50 million
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| Maturity: | Feb. 14, 2011
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| Yield: | 7.0625%
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| Fifth issue:
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| Amount: | $30 million
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| Maturity: | Aug. 14, 2009
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| Yield: | 5.3125%
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