Published on 4/21/2005 in the Prospect News Emerging Markets Daily.
New Issue: Telefonica del Peru sells S/. 70 million series A bonds to yield 5.5%
By Caroline Salls
Pittsburgh, April 21 - Telefonica del Peru SAA said it made its seventh issue under its third program of series A bonds, selling S/. 70 million 18-month bonds to yield 5.5%.
The company said 14,000 bonds were issued.
Telefonica, based in Lima, Peru, is a telecom operator.
| Issuer: | Telefonica del Peru SAA
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| Issue: | Series A bonds
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| Amount: | S/. 70 million
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| Maturity: | Oct. 20, 2006
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| Yield: | 5.5%
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| Pricing date: | April 19
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| Settlement date: | April 20
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