Published on 8/7/2006 in the Prospect News Emerging Markets Daily.
New Issue: Telefonica del Peru prices S/. 57.14 million bonds at par to yield 6.9375%
By Caroline Salls
Pittsburgh, Aug. 7 - Telefonica del Peru SAA made the ninth issue under its fourth program of series A bonds, selling S/. 57.14 million of the bonds at par to yield 6.9375%, according to a company news release.
Lima, Peru-based Telefonica is a telecommunications company. Spain-based Telefonica owns 97% of the company.
Issuer: | Telefonica del Peru SAA
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Issue: | Series A bonds
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Amount: | S/. 57.14 million
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Maturity: | Aug. 7, 2011
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Price: | Par
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Yield: | 6.9375%
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Pricing date: | Aug. 4
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Settlement date: | Aug. 7
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