Taiwan Semiconductor to offer up to NT$45 billion of corporate bonds

By Marisa Wong

Madison, Wis., May 14 - Taiwan Semiconductor Manufacturing Co., Ltd. said its board of directors has approved the issuance of up to NT$45 billion of straight corporate bonds.

The bonds will be issued at par. The coupon and maturity will be determined based on market conditions, the company said.

Proceeds from the non-underwritten offering will be used to purchase machinery equipment.

The semiconductor manufacturer is based in Hsinchu, Taiwan.

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