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Taiwan Semiconductor to offer up to NT$45 billion of corporate bonds
By Marisa Wong
Madison, Wis., June 13 - Taiwan Semiconductor Manufacturing Co., Ltd. said its board of directors has approved the issuance of up to NT$45 billion of straight corporate bonds.
The bonds will be issued at par. The coupon and maturity will be determined based on market conditions, the company said.
Proceeds from the issuance will be used to purchase machinery equipment.
The semiconductor manufacturer is based in Hsinchu, Taiwan.
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