Taiwan Semiconductor eyes up to NT$60 billion, $1 billion bonds

By William Gullotti

Buffalo, N.Y., Feb. 15 – Taiwan Semiconductor Manufacturing Co., Ltd. is considering a two-part offering of corporate bonds, according to a notice on Tuesday.

The New Taiwan dollar-denominated tranche will be for up to NT$60 billion.

The U.S. dollar-denominated tranche is capped at $1 billion.

Proceeds will be used to fund capacity expansion and/or pollution prevention related expenditures for wholly owned subsidiary TSMC Arizona Corp.

Further details regarding price, coupon and issuance period are still to be determined.

The semiconductor manufacturer is based in Hsinchu, Taiwan.

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