By Marisa Wong
Los Angeles, Nov. 30 – Taiwan Semiconductor Manufacturing Co., Ltd. priced NT$16.7 billion of corporate bonds in three tranches, according to a Taiwan Stock Exchange notice.
The issue is comprised of NT$7.7 billion of 0.65% five-year tranche A bonds, NT$3.5 billion of 0.675% 5.5-year tranche B bonds and NT$5.5 billion of 0.72% seven-year tranche C bonds.
All three tranches were priced at par.
Capital Securities Corp. is the lead underwriter.
Proceeds will be used to purchase equipment and expand facilities.
The semiconductor manufacturer is based in Hsinchu, Taiwan.
| Issuer: | Taiwan Semiconductor Manufacturing Co., Ltd.
|
| Amount: | NT$16.7 billion
|
| Issue: | Corporate bonds, 2021 seventh issue
|
| Underwriter: | Capital Securities Corp. (lead)
|
| Announcement date: | Nov. 30
|
|
|
| Tranche A
|
| Amount: | NT$7.7 billion
|
| Maturity: | Five years
|
| Coupon: | 0.65%
|
| Price: | Par
|
| Yield: | 0.65%
|
|
|
| Tranche B
|
| Amount: | NT$3.5 billion
|
| Maturity: | 5.5 years
|
| Coupon: | 0.675%
|
| Price: | Par
|
| Yield: | 0.675%
|
|
|
| Tranche C
|
| Amount: | NT$5.5 billion
|
| Maturity: | Seven years
|
| Coupon: | 0.72%
|
| Price: | Par
|
| Yield: | 0.72%
|
|
|
© 2015 Prospect News.
All content on this website is protected by copyright law in the U.S. and elsewhere.
For the use of the person downloading only.
Redistribution and copying are prohibited by law without written permission in advance from Prospect News.
Redistribution or copying includes e-mailing, printing multiple copies or any other form of reproduction.
