By Marisa Wong
Los Angeles, March 12 – Taiwan Semiconductor Manufacturing Co., Ltd. priced NT$24 billion of corporate bonds in three tranches, according to a Taiwan Stock Exchange notice.
The issue is comprised of NT$3 billion of 0.58% five-year tranche A bonds, NT$10.5 billion of 0.62% seven-year tranche B bonds and NT$10.5 billion of 0.64% 10-year tranche C bonds.
All three tranches were priced at par.
Yuanta Securities Co., Ltd. is the lead underwriter.
Proceeds will be used to purchase equipment and expand facilities.
The semiconductor manufacturer is based in Hsinchu, Taiwan.
| Issuer: | Taiwan Semiconductor Manufacturing Co., Ltd.
|
| Issue: | Corporate bonds, 2020 first issue
|
| Amount: | NT$24 billion
|
| Underwriter: | Yuanta Securities Co., Ltd.
|
| Announcement date: | March 12
|
|
|
| Tranche A
|
| Amount: | NT$3 billion
|
| Maturity: | Five years
|
| Coupon: | 0.58%
|
| Price: | Par
|
| Yield: | 0.58%
|
|
|
| Tranche B
|
| Amount: | NT$10.5 billion
|
| Maturity: | Seven years
|
| Coupon: | 0.62%
|
| Price: | Par
|
| Yield: | 0.62%
|
|
|
| Tranche C
|
| Amount: | NT$10.5 billion
|
| Maturity: | 10 years
|
| Coupon: | 0.64%
|
| Price: | Par
|
| Yield: | 0.64%
|
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