SunEdison Semiconductor to launch $200 million term loan B on Monday

By Sara Rosenberg

New York, April 25 - SunEdison Semiconductor Ltd. will hold a bank meeting on Monday to launch a new $200 million term loan B, according to sources.

Goldman Sachs Bank USA is the lead bank on the deal.

The company said in recent filings with the Securities and Exchange Commission that, in addition to the term loan B, it plans on getting an up to $50 million revolver.

Proceeds will be used to repay intercompany notes in connection with the company's spinoff from SunEdison Inc. and initial public offering of ordinary shares.

SunEdison Semiconductor is a Toa Payoh, Singapore-based developer, manufacturer and seller of silicon wafers to the semiconductor industry.

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