Chicago, Feb. 21 – Semiconductor Manufacturing International Corp. priced $600 million of 2.693% bonds (Baa3) due Feb. 27, 2025, according to a press release on Thursday.
J.P. Morgan Securities plc, ICBC International Securities Ltd., Barclays and UBS AG Hong Kong Branch are the joint global coordinators, joint lead managers and joint bookrunners.
Joining as joint lead managers and joint bookrunners are SPDB International, ICBC Macau, Silk Road International Capital Ltd. and BNP Paribas are the joint lead managers for the Regulation S offering.
Proceeds will be used for capital expenditure for capacity expansion and for other general corporate purposes.
The Shanghai company is a semiconductor foundry, providing integrated circuit foundry and technology services at 0.35-micron to 28-nanometer.
| Issuer: | Semiconductor Manufacturing International Corp.
|
| Issue: | Bonds
|
| Amount: | $600 million
|
| Maturity: | Feb. 27, 2025
|
| Joint global coordinators: | J.P. Morgan Securities plc, ICBC International Securities Ltd., Barclays and UBS AG Hong Kong Branch
|
| Joint lead managers: | J.P. Morgan Securities plc, ICBC International Securities Ltd., Barclays, UBS AG Hong Kong Branch, SPDB International, ICBC Macau, Silk Road International and BNP Paribas
|
| Coupon: | 2.693%
|
| Pricing date: | Feb. 20
|
| Rating: | Moody’s: Baa3
|
| Distribution: | Regulation S
|
|
|
© 2015 Prospect News.
All content on this website is protected by copyright law in the U.S. and elsewhere.
For the use of the person downloading only.
Redistribution and copying are prohibited by law without written permission in advance from Prospect News.
Redistribution or copying includes e-mailing, printing multiple copies or any other form of reproduction.
