RBC restates Cusip number for contingent buffer notes tied to Qualcomm

By Angela McDaniels

Tacoma, Wash., May 21 – Royal Bank of Canada filed an amended pricing supplement for its $250,000 of 0% contingent buffer enhanced notes linked to the common stock of Qualcomm Inc. that restates the Cusip number to 78013GWW1.

As previously reported, the notes priced April 26, settled May 1 and mature May 13, 2020.

If the final share price is greater than or equal to the buffer level, 85% of the initial share price, the payout at maturity will be par plus 10.45%.

Otherwise, investors will receive a number of Qualcomm shares equal to $1,000 divided by the buffer level or, at the issuer’s option, an amount in cash equal to the value of those shares. In this case, the payout will represent a loss of about 1.1765% of the principal amount for each 1% that the final share price is less than the buffer level.

RBC Capital Markets, LLC is the underwriter, and JPMorgan Chase Bank NA and J.P. Morgan Securities LLC are the placement agents.

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