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Published on 5/1/2019 in the Prospect News Structured Products Daily.

New Issue: RBC prices $250,000 contingent buffer enhanced notes tied to Qualcomm

By Sarah Lizee

Olympia, Wash., May 1 – Royal Bank of Canada priced $250,000 of 0% contingent buffer enhanced notes due May 13, 2020 linked to the common stock of Qualcomm Inc., according to a 424B2 filing with the Securities and Exchange Commission.

If the final stock price is greater than or equal to 85% of the initial price, the payout at maturity will be par plus 10.45%.

Otherwise, investors will receive a number of Qualcomm shares equal to the principal amount divided by the buffer level, or cash in lieu of shares at the issuers option. In this case, the value of the shares or cash investors receive will represent a loss of about 1.1765% of the principal amount for each 1% that the final level is less than the buffer level.

RBC Capital Markets, LLC is the underwriter, and JPMorgan Chase Bank NA and J.P. Morgan Securities LLC are the placement agents.

Issuer:Royal Bank of Canada
Issue:Contingent buffer enhanced notes
Underlying stock:Qualcomm Inc. (Symbol: QCOM)
Amount:$250,000
Maturity:May 13, 2020
Coupon:0%
Price:Par
Payout at maturity:If the final stock price is greater than or equal to 85% of the initial price, par plus 10.45%; otherwise, number of Qualcomm shares equal to the principal amount divided by the buffer level, or cash in lieu of shares at the issuers option, representing a loss of about 1.1765% for each 1% that the final level is less than the buffer level
Initial share price:$85.07
Buffer level:$72.31, 85% of initial price
Pricing date:April 26
Settlement date:May 1
Underwriter:RBC Capital Markets, LLC
Placement agents:JPMorgan Chase Bank NA and J.P. Morgan Securities LLC
Fees:1%
Cusip:78013GWW1

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