South Korea's LG Electronics to start roadshow for $600 million bond offering Monday

By Reshmi Basu

New York, May 6 - LG Electronics Inc. will start a roadshow for its dual tranche offering of $600 million of bonds (Baa3/BBB-) during the week of May 9, according to market sources.

The company plans to sell $300 million worth of five-year bonds and $300 million of 10- year bonds.

The roadshow will kick off in Hong Kong and Los Angeles on Monday, then move to Singapore and Boston on Tuesday, and finish off in London and New York on Wednesday.

Citigroup, Credit Suisse First Boston, Lehman Brothers and Korea Development Bank are managing the sale of the Rule 144A/Regulation S (no registration rights) issue.

Pricing is expected after the completion of the roadshow, pending market conditions.

The issuer is a Seoul-based electronics manufacturer.

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