Amkor Technology to repay bank debt with bond sale proceeds

By Sara Rosenberg

New York, March 8 - Amkor Technology Inc. plans to repay amounts outstanding under its senior secured credit facility with proceeds from a proposed $250 million senior notes offering.

Remaining proceeds from the bond sale will be used for general corporate purposes, including capital expenditures, according to a company news release.

Amkor is a West Chester, Pa., subcontractor of semiconductor packaging and test services.

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