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Published on 2/24/2020 in the Prospect News Emerging Markets Daily.

New Issue: China’s Tongling Development prices $200 million 3.98% bonds due 2023

By Sarah Lizee

Olympia, Wash., Feb. 24 – Tongling Development Investment Group Co. Ltd. sold $200 million of 3.98% credit enhanced bonds due 2023, according to a notice of listing on the Stock Exchange of Hong Kong Ltd.

The bonds are backed by an irrevocable standby letter of credit issued by Huishang Bank Corp. Ltd.

Guoyuan Capital, Fosun Hani, Bank of China and ABC International are joint global coordinators, as well as joint bookrunners and joint lead managers together with China Securities International, SPDB International and CMBC Capital.

Listing was expected to become effective last Friday.

The Tongling, China-based company offers investment holding services.

Issuer:Tongling Development Investment Group Co. Ltd.
Issue:Credit enhanced bonds
Amount:$200 million
Maturity:2023
Bookrunners:Guoyuan Capital, Fosun Hani, Bank of China, ABC International (joint global coordinators), China Securities International, SPDB International and CMBC Capital
Coupon:3.98%
Listing date:Feb. 20

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