By Marisa Wong
Los Angeles, Dec. 7 – Hon Hai Precision Industry Co., Ltd. disclosed more details on its NT$12.15 billion of corporate bonds in four tranches in a London Stock Exchange notice on Tuesday.
Hon Hai priced NT$1 billion of 0.55% three-year bonds, NT$ 5.5 billion of 0.63% five-year bonds, NT$4 billion of 0.72% seven-year bonds and NT$1.65 billion of 0.82% 10-year bonds.
Each of the tranches priced at par.
This is the company’s third issue of unsecured corporate bonds for 2021.
The bonds will be issued on Wednesday.
MasterLink Securities Corp. acted as underwriter, as reported.
Proceeds will be used to repay short-term debt, as previously announced.
Hon Hai Precision is a Tu-cheng, Taiwan, manufacturer of computer connectors, cable assemblies and enclosures.
| Issuer: | Hon Hai Precision Industry Co., Ltd.
|
| Amount: | NT$12.15 billion
|
| Issue: | Corporate bonds, 2021 third issue
|
| Underwriter: | MasterLink Securities Corp.
|
| Trustee: | Bank Sinopac Co., Ltd.
|
| Issue date: | Dec. 8
|
|
|
| Series A bonds
|
| Amount: | NT$1 billion
|
| Maturity: | Dec. 8, 2024
|
| Coupon: | 0.55%
|
| Price: | Par
|
| Yield: | 0.55%
|
|
|
| Series B bonds
|
| Amount: | NT$5.5 billion
|
| Maturity: | Dec. 8, 2026
|
| Coupon: | 0.63%
|
| Price: | Par
|
| Yield: | 0.63%
|
|
|
| Series C bonds
|
| Amount: | NT$4 billion
|
| Maturity: | Dec. 8, 2028
|
| Coupon: | 0.72%
|
| Price: | Par
|
| Yield: | 0.72%
|
|
|
| Series D bonds
|
| Amount: | NT$1.65 billion
|
| Maturity: | Dec. 8, 2031
|
| Coupon: | 0.82%
|
| Price: | Par
|
| Yield: | 0.82%
|
|
|
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