By Aleesia Forni
Columbus, Ohio, April 13 - Hong Leong Bank Bhd. (A3//BBB+) priced $300 million 3 1/8% five-year bonds at Treasuries plus 238 basis points, or 99.341 to yield 3.269%, on Thursday, according to a market source.
The issue price was tightened from initial talk of Treasuries plus 255 bps.
Citigroup Global Markets Ltd., HL Bank, Mitsubishi UFJ Securities International plc and Royal Bank of Scotland plc were the joint bookrunners for the deal.
The bond was issued under the company's $1.5 billion euro medium-term not program.
The Kuala Lumpur, Malaysia-based bank will use proceeds for general working capital and other corporate purposes.
| Issuer: | Hong Leong Bank Bhd.
|
| Issue: | Bond
|
| Amount: | $300 million
|
| Maturity: | 2017
|
| Bookrunners: | Citigroup Global Markets Ltd., HL Bank, Mitsubishi UFJ Securities International plc, Royal Bank of Scotland plc
|
| Coupon: | 3 1/8%
|
| Price: | 99.341
|
| Yield: | 3.269%
|
| Spread: | Treasuries plus 238 bps
|
| Trade date: | April 13
|
| Price talk: | Treasuries plus 255 bps
|
| Ratings: | Moody's: A3
|
| Fitch: BBB+
|
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