SS&C Technologies to pay down term loan debt with bond proceeds

By Sara Rosenberg

New York, March 14 – SS&C Technologies Holdings Inc. plans to repay term loan borrowings using proceeds from a $2 billion senior notes offering, according to a market source.

The bond deal was upsized from $750 million.

SS&C is a Windsor, Conn.-based provider of investment and financial software-enabled services and software for the financial services and health care industries.

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