By Marisa Wong
Morgantown, W.Va., March 19 – E.Sun Financial Holding Co., Ltd. said subsidiary E.Sun Bank priced NT$4 billion of subordinate financial debentures in two tranches.
Tranche A consists of NT$2 billion of 1.3% seven-year bonds, and tranche B consists of NT$2 billion of 1.55% 10-year bonds.
Both tranches will be issued at par on March 30.
Proceeds will be used to strengthen the company’s capital structure and enhance the BIS ratio.
This is the Taipei, Taiwan-based bank’s second issue of subordinate financial debentures for 2018.
Issuer: | E.Sun Bank
|
Issue: | Subordinate financial debentures
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Amount: | NT$4 billion
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Pricing date: | March 19
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Settlement date: | March 30
|
|
Tranche A
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Amount: | NT$2 billion
|
Maturity: | March 30, 2025
|
Coupon: | 1.3%
|
Price: | Par
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Yield: | 1.3%
|
|
Tranche B
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Amount: | NT$2 billion
|
Maturity: | March 30, 2028
|
Coupon: | 1.55%
|
Price: | Par
|
Yield: | 1.55%
|
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