By Marisa Wong
Madison, Wis., June 20 - E.Sun Bank priced NT$2.72 billion of 1.68% subordinate financial debentures due June 28, 2022 at par, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
This is E.Sun's second issue of subordinate financial debentures for 2012. The bank announced in March that it planned to issue NT$5 billion of debentures in 2012. The first tranche, consisting of NT$2.28 billion of 1.58% bonds due 2019, settled on April 27.
The second tranche will settle on June 28.
Proceeds will be used to strengthen the bank's capital structure and enhance the BIS ratio.
The bank is based in Taipei, Taiwan.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinate financial debentures
|
| Amount: | NT$2.72 billion
|
| Maturity: | June 28, 2022
|
| Coupon: | 1.68%
|
| Price: | Par
|
| Yield: | 1.68%
|
| Settlement date: | June 28
|
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