By Marisa Wong
Madison, Wis., April 18 - E.Sun Bank priced NT$2.28 billion of 1.58% subordinated financial debentures due April 27, 2019 at par, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
This is the bank's first issue of subordinated financial debentures for 2012. The bank announced last month that it planned to issue NT$5 billion of debentures in 2012.
The first tranche will settle on April 27.
Proceeds will be used to strengthen the bank's capital structure and enhance the BIS ratio.
The bank is based in Taipei, Taiwan.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinated financial debentures
|
| Amount: | NT$2.28 billion
|
| Maturity: | April 27, 2019
|
| Coupon: | 1.58%
|
| Price: | Par
|
| Yield: | 1.58%
|
| Settlement date: | April 27
|
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