By Marisa Wong
Madison, Wis., Oct. 17 - E.Sun Bank priced NT$2.9 billion of 1.8% subordinate financial debentures due Oct. 28, 2018 at par, according to an announcement by parent company E.Sun Financial Holding Co., Ltd.
This is the bank's second issue of subordinate financial debentures for 2011. The bank announced earlier this year that it planned to issue NT$5 billion of debentures in 2011. In May the bank issued a first tranche of NT$2.1 billion of 1.73% debentures due 2018.
The second tranche will settle on Oct. 28.
Proceeds will be used to strengthen the bank's capital structure and enhance the BIS ratio.
The bank is based in Taipei, Taiwan.
| Issuer: | E.Sun Bank
|
| Issue: | Subordinate financial debentures
|
| Amount: | NT$2.9 billion
|
| Maturity: | Oct. 28, 2018
|
| Coupon: | 1.8%
|
| Price: | Par
|
| Yield: | 1.8%
|
| Settlement date: | Oct. 28
|
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