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Published on 2/4/2013 in the Prospect News Structured Products Daily.

HSBC plans buffered uncapped market participation notes on the Dow

By Marisa Wong

Madison, Wis., Feb. 4 - HSBC USA Inc. plans to price 0% buffered uncapped market participation securities due Feb. 28, 2017 linked to the Dow Jones industrial Average, according to an FWP filing with the Securities and Exchange Commission.

The payout at maturity will be par plus any index gain.

Investors will receive par if the index falls by up to the buffer amount of 20% to 25% and will be exposed to losses beyond the buffer, which will be set at pricing.

HSBC Securities (USA) Inc. is the underwriter.

The notes will price Feb. 25 and settle Feb. 28.

The Cusip number is 40432XAG6.


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