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Published on 3/15/2018 in the Prospect News Structured Products Daily.

Credit Suisse plans capped knock-out notes tied to PHLX Semiconductor

New York, March 15 – Credit Suisse AG, London Branch plans to price 0% capped knock-out notes due April 3, 2019 linked to the PHLX Semiconductor Sector index, according to a 424B2 filing with the Securities and Exchange.

The payout at maturity will be par plus any index gain, capped at par plus 16.25%.

If the stock declines but by no more than the 20% knock-out buffer then the payout at maturity will be par.

A knock-out event will occur if the stock finishes below its initial level by more than the knock-out buffer amount and in that case investors will be fully exposed to the decline in the stock.

J.P. Morgan Securities LLC is the agent.

The notes are expected to price on March 16 and settle on March 21.

The Cusip is 22550WK22.


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