By William Gullotti
Buffalo, N.Y., Jan. 3 – Unimicron Technology Corp. is issuing NT$3 billion 0.79% unsecured corporate bonds at par, according to a notice Monday.
Fubon Securities Co., Ltd. is the lead underwriter for the public offering. CTBC Bank Co., Ltd. is the trustee and principal paying agent.
Proceeds from the bonds will be used for capacity expansion, enriching working capital, repaying debts or supporting funding needs.
The company is a printed circuit board manufacturer based in Taiwan.
| Issuer: | Unimicron Technology Corp.
|
| Issue: | Corporate bonds
|
| Amount: | NT$3 billion
|
| Maturity: | 2027
|
| Underwriter: | Fubon Securities Co., Ltd.
|
| Trustee: | CTBC Bank Co., Ltd.
|
| Coupon: | 0.79%
|
| Price: | Par
|
| Yield: | 0.79%
|
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