Taiwan’s Unimicron to issue up to NT$8 billion corporate bonds

By William Gullotti

Buffalo, N.Y., Oct. 26 – Unimicron Technology Corp.’s board of directors has approved the issuance of up to NT$8 billion corporate bonds at par, according to a notice Tuesday.

According to the notice, the unsecured bonds may be issued at once or in installments with tenors not to exceed 10 years. The bonds will bear a fixed coupon to be determined at the time of issue.

Proceeds from the bonds will be used for capacity expansion, enriching working capital, repaying debts or supporting funding needs.

The company is a printed circuit board manufacturer headquartered in Taiwan.

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