By Rebecca Melvin
New York, May 26 – Xi’an Aerospace High-Tech Industry Development Co., Ltd. priced $200 million of 3.95% credit enhanced bonds due 2023, according to a listing notice filed with the Stock Exchange of Hong Kong, Ltd.
The bonds are backed by an irrevocable standby letter of credit issued by Bank of Xi’an Co. Ltd.
Fosun Hani (global coordinator), China Securities International, Dongxing Securities (Hong Kong), Wilson Securities, China Minsheng Banking Corp. Ltd. Hong Kong Branch, Shanghai Pudong Development Bank Hong Kong Branch, Industrial Bank Co. Ltd. Hong Kong Branch and Bank of Communications were joint lead managers and joint bookrunners.
The listing was expected to become effective on May 27.
The aircraft manufacturer is based in Shaanxi, China.
| Issuer: | Xi’an Aerospace High-Tech Industry Development Co., Ltd.
|
| Obligor: | Bank of Xi’an Co. Ltd.
|
| Issue: | Credit enhanced bonds
|
| Amount: | $200 million
|
| Maturity: | 2023
|
| Bookrunners: | Fosun Hani, China Securities International, Dongxing Securities (Hong Kong), Wilson Securities, China Minsheng Banking Corp. Ltd. Hong Kong Branch, Shanghai Pudong Development Bank Hong Kong Branch, Industrial Bank Co. Ltd. Hong Kong Branch and Bank of Communications
|
| Coupon: | 3.95%
|
| Expected listing date: | May 27
|
| Distribution: | Regulation S
|
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